赛邦电子专注硅片进出口

EMAIL US

sales@sibranch.com

CALL US

+86-574-8745-9965

+86-188-5806-1329

加工定制

Service

晶圆减薄 Si Wafer BackGrinding

切割减薄/Dicing & BackGrinding

￥0.00

￥0.00
晶圆切割 Si Wafer Dicing

切割减薄/Dicing & BackGrinding

￥0.00

￥0.00
晶圆减径倒边 Wafer Resizing/Edge Rou...

减径倒边/Wafer Resizing&Edge Rounding

￥0.00

￥0.00
微纳加工/MEMS

微纳加工/MEMS

￥0.00

￥0.00
TAIKO Wafer&Thin Wafer Compari...

切割减薄/Dicing & BackGrinding

￥0.00

￥0.00

< 1 >

Copyright © 2013-2020,www.sibranch.com,All rights reserved 浙ICP备15025834号-1 版权所有：赛邦芯微电子科技有限公司

Contact Us

Tel : +86-574-87459965 / Cell : +86-18858061329

Wechat : 18858061329 or sibranch / QQ : 7258183 / Skype : leowang519

Email : sales@sibranch.com